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Technical measures to improve the reliability of PCB equipment

time2018/9/6 10:41:10 Click

Technical measures to improve the reliability of PCB equipment: plan selection, circuit design, circuit board design, structural design, component selection and manufacturing process, etc. PCB Manufacturing Specific measures are as follows:

(1) simplify the scheme design.

In the scheme design, on the premise of ensuring that the equipment meets the technical and performance indexes, the design should be simplified as much as possible, and the circuit and structure design should be simplified to make each part the simplest design. The modularization design method which is popular in the world is an effective measure to improve the equipment reliability. The block function is relatively single, and the system is composed of modules, which can reduce the complexity of the design and standardize the design. A lot of facts at home and abroad have proved this, product design should adopt modular design method.

(2) adopt modules and standard components.

Modules and standard components are proven to be highly reliable products after a lot of tests and extensive use, which can fully eliminate defects and hidden dangers of the equipment and bring convenience for replacement and repair after problems occur. The adoption of modules and standardized products can not only effectively improve the reliability of the equipment, but also greatly shorten the development cycle, providing extremely favorable conditions for the rapid modification and assembly of the equipment.

(3) improve integration.

Select large - scale and super - scale integrated circuits with strong functions and high integration to minimize the number of components. The fewer the components, the fewer the hidden trouble points. This will not only improve the reliability of the equipment, but also. Can shorten the development and development cycle.

(4) derating design.

Derating design refers to the components under the condition of lower than the nominal stress work, is one of the effective methods to reduce the failure rate of components, therefore, is designed on the premise of ensure the technical performance indicators, when the working voltage range, the temperature characteristics of components, the electric characteristic parameters such as adopt derating use method, so as to reduce the failure rate of the components under various stress conditions.

Derating design, different components to consider the factors are different: some voltage range, some current size, some temperature, some frequency, some vibration and so on. In general, high voltage, frequency and temperature characteristics of capacitance and resistance of power, current and frequency characteristic of inductance, diode, triode, SCR, operational amplifier, drives, gate junction current and junction temperature of the device or the fan out coefficient, the switch of power supply and main power source voltage/current resistance and heat resistance performance of cable, signal cable frequency characteristic, and the radiator, connectors, modules, power supply such as the use of the requirements for derating design.

(5) select high-quality devices.

Component is the basic unit of equipment, its quality will directly affect the equipment reliability. Military communications equipment should be as far as possible industrial grade products, preferably military products, and prior to the computer aging screening strictly to eliminate early failure components.

(6) make full use of software resources.

Due to the flexibility of software programming, software resources should be fully utilized in design. At present, there are many methods and tools for debugging software, easy to locate fault and design problems, and the solution cycle is relatively short. Making full use of software resources is an important way to improve reliability.

(7) reliable structure, mature technology and advanced technology.

In the design of circuits and structures, the number of connectors and metallized holes should be reduced as much as possible. Circuit devices and chips should be welded directly on the printed plate as far as possible, surface mounting devices should be selected and surface mounting technology should be adopted to avoid poor contact and ensure equipment reliability.

(8) thermal design.

The over-high temperature is one of the important factors that cause the equipment performance and reliability to be reduced. Therefore, thermal protection measures should be taken to control and reduce the temperature rise when the equipment is working, ensure good heat dissipation and improve the thermal reliability of the equipment.

If the temperature is too low, the performance and reliability of the equipment will be reduced. Some components cannot work normally when the ambient temperature is too low. So the equipment that is used in a low temperature environment should also be tested at low temperature. The temperature condition and environment of the equipment must be considered in the design.

(9) electromagnetic compatibility design.

Equipment can be disturbed by many electromagnetic fields, both natural and human. Military equipment is even more so. In modern high-tech electronic warfare, an important technical means is to locally emit high-energy electromagnetic waves to destroy the components of the other party's equipment, thus causing the equipment to fail. For this reason, effective anti-interference measures such as shielding and filtering should be taken to prevent the interference of noise and electromagnetic field on the equipment to ensure reliable operation of the equipment.

(10) anti-vibroflotation design.

In the process of use and transportation, the equipment will be affected by a variety of vibration and impact, thus affecting its reliability. Therefore, the mechanical strength and stiffness of the equipment should be improved, and vibration buffering measures should be taken to strengthen the equipment's ability to resist vibration and impact, so as to improve the reliability of the equipment.

(11) adopt fault indicating device.

The fault detection circuit and the fault alarm device are designed to detect the fault in time, so as to shorten the time of equipment fault maintenance.

(12) simple operation and convenient maintenance.

The function of operation and maintenance is one of the main factors to ensure the equipment reliability. In the design, insert units and modules should be adopted as far as possible, while modularization, standardized structure and rapid disassembly structure should be adopted to facilitate operation and maintenance. It has been proved that the modularization structure of the equipment can greatly simplify operation and facilitate maintenance.

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